Mount Royal Lead-free solder paste cleaning MP100, superior print performance, especially for assembly-intensive products such as mobile phone users. 
 Products:. Loctite LF328 lead-free solder paste 
 Excellent printability, excellent air-raid shelter capacity, ideal for mobile phones, handheld computers and other dense components lead-free reflow and high-speed printing applications. 

 Muticore? Product Code consists of the following four components: 
 96SC LF320 AGS 88 
 (1) Alloy code (2) flux media (3), tin powder size code (4) metal content 
 (1) Alloy code 
 No matching alloy 
 Lead-Tin-lead 
 Sn62 
 Sn63 
 63S4 Sn62 Pb36 Ag2 
 Sn63 Pb37 
 Lead-free anti-tombstoning unique formula 
 Lead-free 
 96SC (SAC387) 
 97SC (SAC305) 
 96S 
 88SIB Sn95.5 Ag3.8 Cu0.7 
 Sn96.5 Ag3.0 Cu0.5 
 Sn96.5 Ag3.5 
 Sn88 Ag3.5 In8 Bi0.5 
 (2) Flux Media Signal 
 Lead-Tin-lead 
 RP15 CR32 CR37 MP100 MP200 MP218 lead-free Lead-free 
 LF300 LF310 LF318 LF320 LF328 (3) tin powder size code 
 No. IPC number size distribution 
 AGS ADP 
 ACP 
 DAP 
 25-45 micron 15-38 micron 
 20-38 micron 
 20-38 micron 
 3, almost 4 powder powder 
 Nearly 4 powder 
 4 Powder 

 Applications of lead solder paste alloys wet strength (G./M2) Printing speed (mm / s) activity classification (IPC) CR32 Universal, flash point for consumer electronics products, to provide anti-cavity formulation 63S4 Sn62 Sn63 BGA 1.2 25-150 ROLO CR37 Universal, flash point for consumer electronics products, for OSP solder Sn62 Sn63 1.3-1.4 25-150 ROL1 RP15 high activity, especially for OSP welding, to provide anti-cavity formulation 63S4 Sn62 BGA Sn63 1.4-1.6 25-150 ROL1 MP100 superior print performance, especially for intensive phone users, and assembling products Sn62 Sn63 1.2-1.4 20-200 ROLO MP200 suitable for fine pitch and high requirements such as application 0201